28-12-2015, 03:25 PM
Hello Pat, and welcome from me, too 
Thank you for the compliment! From your experience, it does sound like moisture ingress is the basic problem with the Lockfit package - I know practically nothing about the detail of encapsulation, but wonder if the problem is between the metal and the plastic? Relatively speaking, there is a large overlap compared to other packages, and it's easy to imagine how imperfections in the process could cause that boundary to allow moisture in. Your reports might be anecdotal in the strictest sense, but still very useful as far as I'm concerned. What sort of sample sizes are we talking about here?
Regarding the spelling of Lockfit, I have seen alternatives. I went with "Lockfit" as that's what Mullard seemed to use most often in their documentation, although "Lock-fit" is an alternative. I don't recall them dropping the "k", but I'd welcome any clarification. Another factor, of course, is to consider what people are most likely to type into a search engine
Thanks again, and enjoy the forum,
Mark
Thank you for the compliment! From your experience, it does sound like moisture ingress is the basic problem with the Lockfit package - I know practically nothing about the detail of encapsulation, but wonder if the problem is between the metal and the plastic? Relatively speaking, there is a large overlap compared to other packages, and it's easy to imagine how imperfections in the process could cause that boundary to allow moisture in. Your reports might be anecdotal in the strictest sense, but still very useful as far as I'm concerned. What sort of sample sizes are we talking about here?
Regarding the spelling of Lockfit, I have seen alternatives. I went with "Lockfit" as that's what Mullard seemed to use most often in their documentation, although "Lock-fit" is an alternative. I don't recall them dropping the "k", but I'd welcome any clarification. Another factor, of course, is to consider what people are most likely to type into a search engine

Thanks again, and enjoy the forum,
Mark







