13-08-2014, 09:45 AM
You are correct in that its a slow-ish process for heavy stuff but it does work - I often pre-heat larger lumps to speed things up...
Currently I'm designing a board around a micro-processor in a 48VQFN package - 48 pins on a 7mm x 7mm chip (including leads) - pin centres are 0.5mm apart and each pin 0.25mm wide, so pin separation is 0.25mm.
You easily do this sort of stuff with Metcal kit, but in this case I'll also be using a laser-cut mylar solder stencil and paste...
A 200W gas iron might be a little severe...
Currently I'm designing a board around a micro-processor in a 48VQFN package - 48 pins on a 7mm x 7mm chip (including leads) - pin centres are 0.5mm apart and each pin 0.25mm wide, so pin separation is 0.25mm.
You easily do this sort of stuff with Metcal kit, but in this case I'll also be using a laser-cut mylar solder stencil and paste...
A 200W gas iron might be a little severe...
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