Just a quick point - if you are using transparencies to make a photo-resist mask, make sure you print in "mirror" format...
This is so that the ink surface is in contact with the photo-resist, thus when UV exposure happens, there is little "under-cutting" due to the UV getting behind the ink due to the ink being separated from the board by the transparent acetate.
The edges of your traces will be much better this way and fine detail will not be lost. I know its not so important here, but when making boards for fine-pitched SMD components (down to 0.5mm pin pitch), thinks like this are important.
Also, immersion tin plating is neat and prevents the traces from corroding - you could of course solder-wipe them too.
If you are concerned about the current carrying capacity of traces, you might find my calculator at http://www.desmith.net/NMdS/Electronics/TraceWidth.html helpful.
Cheers
This is so that the ink surface is in contact with the photo-resist, thus when UV exposure happens, there is little "under-cutting" due to the UV getting behind the ink due to the ink being separated from the board by the transparent acetate.
The edges of your traces will be much better this way and fine detail will not be lost. I know its not so important here, but when making boards for fine-pitched SMD components (down to 0.5mm pin pitch), thinks like this are important.
Also, immersion tin plating is neat and prevents the traces from corroding - you could of course solder-wipe them too.
If you are concerned about the current carrying capacity of traces, you might find my calculator at http://www.desmith.net/NMdS/Electronics/TraceWidth.html helpful.
Cheers
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