29-07-2015, 07:44 PM
I intend to make a little PWM speed controller for controlling the speed of a 12V PCB drill.
I've already got one that I made 25 years ago, but I work indoors and in an outdoor workshop, so another would be handy to have.
Circuits for such things abound on internet and I've found one for which, fortuitously, I've got all the bits in my spares box. I've developed a component layout from the circuit, which is attached showing an 'X-Ray' of the PCB track layout from which I'll later make a PCB mask, but at this stage I'm after a bit of advice on heat sinking for the N-Channel FET used in the design. It's an IRL530N mosfet (TO-220 package), which I understand can handle current up to 27A. It was chosen by the designer of the circuit as it has fast switching and Low on-resistance. In this application, the PCB drill is unlikely to draw more than 2 Amps - 3 at most, and will be used for maybe up to half an hour, on load for drilling each hole in a PCB, which takes only a matter of a few seconds at a time, with a brief pause between each hole drilled.
I'm wondering if the FET needs to be heat-sinked, and if so, would the small heat-sink in the attached pic be adequate if screwed down to the PCB with the FET laying flat, which would obviate the need for a larger heat-sink mounted onto say a metal back-plate on an enclosure - I'd rather avoid that if possible? I could of course always try it and see what happens but it makes sense to ask the question whilst at the development stage.
Some aspects of the component overlay in the attached diagram aren't to scale - the 78L05 voltage regulator for example is shown overly large. Initially I was going to use a7805 in a TO-220 package for that role, but it's only there to provide the 5V for the 555 IC, so a 78L05 should be more than adequate for that.
Any thoughts on the heat-sink query anyone please?
I've already got one that I made 25 years ago, but I work indoors and in an outdoor workshop, so another would be handy to have.
Circuits for such things abound on internet and I've found one for which, fortuitously, I've got all the bits in my spares box. I've developed a component layout from the circuit, which is attached showing an 'X-Ray' of the PCB track layout from which I'll later make a PCB mask, but at this stage I'm after a bit of advice on heat sinking for the N-Channel FET used in the design. It's an IRL530N mosfet (TO-220 package), which I understand can handle current up to 27A. It was chosen by the designer of the circuit as it has fast switching and Low on-resistance. In this application, the PCB drill is unlikely to draw more than 2 Amps - 3 at most, and will be used for maybe up to half an hour, on load for drilling each hole in a PCB, which takes only a matter of a few seconds at a time, with a brief pause between each hole drilled.
I'm wondering if the FET needs to be heat-sinked, and if so, would the small heat-sink in the attached pic be adequate if screwed down to the PCB with the FET laying flat, which would obviate the need for a larger heat-sink mounted onto say a metal back-plate on an enclosure - I'd rather avoid that if possible? I could of course always try it and see what happens but it makes sense to ask the question whilst at the development stage.
Some aspects of the component overlay in the attached diagram aren't to scale - the 78L05 voltage regulator for example is shown overly large. Initially I was going to use a7805 in a TO-220 package for that role, but it's only there to provide the 5V for the 555 IC, so a 78L05 should be more than adequate for that.
Any thoughts on the heat-sink query anyone please?
